Actasys

By precisely cooling thermal hotspots, Actasys allows data centers to raise setpoint temperatures, reducing HVAC energy use, improving efficiency, and cutting overall carbon emissions

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About Us

Actasys introduces unique actuators that tackle the overheating problems in data centers where traditional solutions fall short, often being too large and lacking effective heat removal capabilities. By resolving these overheating issues, particularly in server ports, Actasys not only boosts computational power but also facilitates the functioning of GPUs, CPUs, and storage units. This enhancement is crucial for running complex AI models, as it ensures effective communication and data processing capabilities necessary for advanced AI applications.
As the need for computational power grows, data centers encounter significant challenges like overheating in optical cables and server ports due to increasing data speeds required for connectivity. This overheating is a major operational & enviormental bottleneck, limiting the scalability, efficiency, and sustainability of data centers. Actasys addresses this issue by providing advanced thermal management solutions that achieve higher performance with minimal footprint. This ensures that artificial intelligence can operate at its full potential, benefitting customers across various industries, without compromising the environment

Relevant Challenges

Energy Efficiency

Actasys introduces unique actuators that tackle the overheating problems in data centers where traditional solutions fall short, often being too large and lacking effective heat removal capabilities. By resolving these overheating issues, particularly in server ports, Actasys not only boosts computational power but also facilitates the functioning of GPUs, CPUs, and storage units. This enhancement is crucial for running complex AI models, as it ensures effective communication and data processing capabilities necessary for advanced AI applications

Decarbonizing Data Centers

ActaJet enables AI by addressing the thermal bottleneck created by modern semiconductor advances. As AI chips, transceivers, and edge modules pack more power into smaller footprints, performance is increasingly limited by localized hotspots rather than total system airflow. ActaJet applies precise, electronically controlled airflow exactly where heat is generated, enabling fine-grained thermal control that aligns with how modern semiconductors manage power and performance. Its compact, solid-state form factor allows it to be co-designed directly into advanced packaging, dense networking hardware, and edge AI modules, without the size, reliability, or integration penalties of fans or liquid systems. This becomes especially critical as AI moves beyond the data center into sealed, rugged, real-world deployments, where ActaJet unlocks sustained performance and reliability that existing cooling approaches cannot deliver

Energy Efficient Computation

Actasys introduces unique actuators that tackle the overheating problems in data centers where traditional solutions fall short, often being too large and lacking effective heat removal capabilities. By resolving these overheating issues, particularly in server ports, Actasys not only boosts computational power but also facilitates the functioning of GPUs, CPUs, and storage units. This enhancement is crucial for running complex AI models, as it ensures effective communication and data processing capabilities necessary for advanced AI applications

Year Founded:
2013
Country:
Israel
Funding Stage:
Seed
Product Stage:
Pilot to First Paying Customer
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